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  1 nic components corp. www.niccomp.com www.lowesr.com www.rfpassives.com www.smtmagnetics.com specifications are subject to change features ? low esr and high ripple current ratings ? values from 10 f to 470 f ? suitable for flow and re ow soldering processes ? available in eia b, c and d case sizes standard ratings and case size specifications ntc-l 106 k 16 tr b f rohs compliant case code packaging: tr=tape/reel voltage tolerance code: k=10% capacitance code series part number system low esr tantalum chip capacitors ntc-l series capacitance range 10 f to 470 f capacitance tolerance 10% (k) operating temperature range -55c ~ +125c (voltage derating above 85c, see table below) dissipation factor @ 120hz/25c see part number & speci cations table capacitance change versus temperature -55c +85c +125c c -10% c +10% c +12% soldering heat resistance (+260c for 5~10 sec.) c 10% max., leakage current and dissipation factor will be less than value speci ed below. moisture resistance (500 hours; 90~95% rh @ 40c load life test @at rated voltage 2,000 hours @ 85c base failure rate (1.0 /volt) 1%/1000 hours at 60% con dence level (+85c) rated voltage @ 85c 6.3vdc 10vdc 16vdc 20vdc 25vdc 35vdc surge voltage @ 85c 8 1320263245 derated voltage @125c 4 6.3 10 13 16 22 capacitance ( f) code case size case size case size case size case size case size 10 106 --bc-d 15 156 - b - cdd 22 226 bccddd 33 336 ccddd - 47 476 cddd - - 68 686 -dd- - - 100 107 ddd - - - 150 157 dd---- 220 227 dd---- 330 337 dd---- 470 477 d----- *see part number system for details precautions please review the notes on correct use, safety and precautions found on our website at www.niccomp.com/tantpc if in doubt or uncertainty, please review your speci c application - process details with nic?s technical support personnel: tpmg@niccomp.com rohs compliant includes all homogeneous materials
2 nic components corp. www.niccomp.com www.lowesr.com www.rfpassives.com www.smtmagnetics.com specifications are subject to change low esr tantalum chip capacitors case dimensions (mm) terminations: 100% sn (lead-free) standard a h l l 2 i 2 w 1 + c b b l 1 d case size a h l l 2 w 1 + c b b l 1 i 2 b and c case size ntc-l series case code l 0.2 w 0.2 hl 0.2 i 1 0.2 i 2 0.2 a 0.2 b 0.2 c 0.2 b 3.4 2.6 1.9 1.4 0.8 2.0 0.7 2.2 c 5.8 3.2 2.5 2.4 1.3 2.2 0.7 2.4 d 7.3 4.30.3 2.8 3.8 1.3 2.4 1.2 3.3 part number cap. ( f) voltage (vdc) dissipation factor @ 120hz/20c leakage current ( a) @ 25c esr (ohms) @ 100khz/20c ripple current rating (ma) @ 100khz/25c ntc-l226k6.3trbf 22 6.3 0.06 1.4 0.50 440 ntc-l336k6.3trcf 33 0.06 2.1 0.35 530 ntc-l476k6.3trcf 47 0.06 3.0 0.35 530 ntc-l107k6.3trdf 100 0.08 6.3 0.15 890 ntc-l157k6.3trdf 150 0.08 9.5 0.10 1,100 ntc-l227k6.3trdf 220 0.10 14 0.10 1,100 ntc-l337k6.3trdf 330 0.10 20.8 0.10 1,100 ntc-l477k6.3trdf 470 0.18 32.9 0.20 770 ntc-l156k10trbf 15 10 0.06 1.5 0.60 400 ntc-l226k10trcf 22 0.06 2.2 0.50 440 ntc-l336k10trcf 33 0.06 3.3 0.35 530 ntc-l476k10trdf 47 0.06 4.7 0.25 690 ntc-l686k10trdf 68 0.06 6.8 0.20 770 ntc-l107k10trdf 100 0.08 10 0.10 1,100 ntc-l157k10trdf 150 0.08 15 0.10 1,100 ntc-l227k10trdf 220 0.10 22 0.10 1,100 ntc-l337k10trdf 330 0.18 33 0.15 890 ntc-l106k16trbf 10 16 0.06 1.6 0.60 400 ntc-l226k16trcf 22 0.06 3.5 0.40 500 ntc-l336k16trdf 33 0.06 5.3 0.25 690 ntc-l476k16trdf 47 0.06 7.5 0.20 770 ntc-l686k16trdf 68 0.06 11 0.15 890 ntc-l107k16trdf 100 0.08 16 0.10 1,100 ntc-l106k20trcf 10 20 0.06 2.0 0.60 400 ntc-l156k20trcf 15 0.06 3.0 0.50 440 ntc-l226k20trdf 22 0.06 4.4 0.35 580 ntc-l336k20trdf 33 0.06 6.6 0.30 630 ntc-l476k20trdf 47 0.06 9.4 0.20 830 ntc-l156k25trdf 15 25 0.06 3.8 0.30 630 ntc-l226k25trdf 22 0.06 5.5 0.30 630 ntc-l336k25trdf 33 0.06 8.3 0.30 630 ntc-l106k35trdf 10 35 0.06 3.5 0.30 630 ntc-l156k35trdf 15 0.06 5.3 0.30 630 ntc-l226k35trdf 22 0.06 7.7 0.50 490 part number and specifications table
3 nic components corp. www.niccomp.com www.lowesr.com www.rfpassives.com www.smtmagnetics.com specifications are subject to change low esr tantalum chip capacitors ntc-l series taping specifications (mm) recommended soldering profiles note: to avoid thermal shock a preheating stage, 130c ~ 160c for 1 minute, should be incorporated into the soldering process 9.0 0.3 2.0 0.5 178 2.0 60.0 0.5 21.0 0.8 13.0 0.5 60 40 20 0 220 210 200 190 260 250 240 230 temperature (deg. c) time (seconds) re ow soldering - permitted temperature/time range 30 40 20 0 220 210 200 260 250 240 230 temperature (deg. c) time (seconds) flow soldering - permitted temperature/time range 10 b case c & d 300 200 0 60 30 0 135 125 100 90 temperature (deg. c) time (seconds) re ow soldering - recommended pro le maximum temperature/time: 260c/10 sec. 100 160 150 temperature (deg. c) 300 200 0 60 30 0 135 125 100 90 time (seconds) flow soldering - recommended pro le maximum temperature/time: 245c/5 sec. 100 160 150 5 sec. 150 250 50 case code a 0.1 b 0.1 c 03 d 0.1 e 0.1 f 0.1 g 0.1 h 0.1 j 0.1 k max. t max. reel qty b 3.1 3.8 8.0 3.5 1.75 4.0 2.0 4.0 1.5 2.5 0.2 2000 c 3.7 6.3 12.0 5.5 1.75 8.0 2.0 4.0 1.5 3.0 0.3 500 d 4.8 7.7 12.0 5.5 1.75 8.0 2.0 4.0 1.5 3.4 0.3 500 f a d k c b j h t cover tape e g anode


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